Currently, oxidation reaction, poor wettability and high peak temperature in reflow soldering will do harm to electronic solder joints. To offset these effects, using nitrogen to inert the atmosphere during soldering has become a globally accepted practice in electronic assembly. Nitrogen atmosphere improves the wettability of solder, reduces the degree of oxidation, and accelerates the speed of soldering reaction.
Whatever you need to control the atmosphere within your reflow ovens and simultaneously decrease nitrogen costs, Nexelia for Reflow Soldering is the unrivalled option.
The Nexelia solution
A comprehensive gas solution designed for and adapted to your specific needs, Nexelia for Reflow Soldering combines the best of our gases, application technologies and expert support. As with all solutions under the Nexelia label, we work closely with you to pre-define a concrete set of results, and we commit to delivering them.
A complete retrofit solution, Nexelia for Reflow Soldering was expertly designed by Air Liquide to generate and carefully monitor inert atmosphere into your reflow oven. The solution combines nitrogen supply with an automated controlling system to automatically adjust the inert atmosphere composition in the reflow oven.
Nexelia for Reflow Soldering is for the sectors within the electronics manufacturing industry that use reflow soldering process.
Nitrogen savings of 5% to 15%
ATMOSPHERE CONTROLLER-E monitors and constantly regulates the nitrogen flow to maintain the required Residual Oxygen Level (ROL) inside the reflow oven. No need of over consumption for clearances, nitrogen consumption is permanently optimized, whatever the operating conditions.
Continous quality monitoring of reflow atmosphere
ATMOSPHERE CONTROLLER-E detects and adjusts the internal atmosphere quality of the reflow oven throughout the day. The system works as a virtual operator, checking and adjusting the ROL in the reflow zone in real time, in accordance with the specifications. The equipment consistently maintains optimal performance levels, even with flexible production.
An easy-to-operate system
The installation of ATMOSPHERE CONTROLLER-E requires no modification of your reflow oven, neither maintenance. You only have to adjust the required ROL set point, and the Air Liquide control system starts to monitor.
Nexelia for Reflow Soldering consists of:
Nitrogen supply: from liquid storage or in a gaseous state on-site production system, nitrogen requirement is carefully calculated by our teams to ensure an optimized performance of your reflow soldering process.
ATMOSPHERE CONTROLLER- E is a patented, automatic-control system designed by Air Liquide for the cautious monitoring of inert atmosphere into your reflow oven.
The system is suitable for oxygen-level ranking from 0 to 3,000 ppm.
The full support of our application experts, from the very first point of the solution’s design, right down to its implementation and maintenance.